Taiwanese low-cost chipset developer MediaTek has announced its first 10-core chipset in the Helio X20, a chipset that combines three types of application cores and a graphics unit in what it calls a TriCluster configuration for less heat and increased performance compared to more conventional dual-cluster designs.
The application cores consist of two ARM Cortex A72 cores at 2.5 GHz, four Cortex A53 cores at 2.0 GHz, and four Cortex A53 cores at 1.4 GHz tied together with MediaTek’s CorePilot 3.0 scheduling algorithm to send tasks to the proper bank of cores for optimum performance and efficiency.
In the ideal setup, the Cortex A72 cores will be tasked with extreme performance loads, while the Cortex A53 cores will handle medium performance, and the lowest bank of Cortex A53 cores will handle light loads. The processor will also include an integrated LTE modem while the graphics unit will be a Mali T880 for the highest graphics performance.
The Helio X20 will be sampling to manufacturers by the third quarter of the year and MediaTek expects commercial releases with the chip by December.
